At first, the industry was skeptical: how could this LFPAK56, less than half the size of a DPAK, achieve equivalent thermal performance? Some doubted the reliability of the clip attachment, although the physics was beyond doubt: soldering the clip directly to the source connection on the die eliminates the areas of high current density that normally occur where bond wires are attached. Thus, copper clip prevents the formation of temperature “hotspots” at these locations and so protects the transistor.
Reliability and thermal performance testing duly showed that the LFPAK could perform as claimed. LFPAK56 has also passed the stringent AEC-Q101 automotive qualification and, in fact, significantly exceeded every requirement.
We shipped more than 1.7 billion LFPAK devices in 2021, including MOSFETs and bipolar power transistors in LFPAK56 and its later derivatives from small size of 3 mm x 3 mm LFPAK33 to 8 mm x 8 mm LFPAK88. With the new CCPAK1212 now adding to the copper clip success story, we expect this technology to feature prominently in advanced power semiconductors for generations to come, either using GaN, SiC or MOSFETs devices.
Learn more about 20 years of LFPAK innovation on our YouTube channel – https://hubs.li/Q01KL0jC0
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