Did you know that we delivered almost 1.64 billion LFPAKs in 2021 alone? That works out to around 136 million per month, 4.5 million per day or roughly 52 per second.
Around 90% of our product range now uses the LFPAK loss-free package that introduced copper clip back in 2002, and this technology features prominently in the new CCPAK1212 that houses our latest GaN FETs.
We developed the LFPAK to meet the computing industry’s need for extremely high current when powering the latest processors. As each new silicon technology node brought exponentially more transistors on-chip and lowered the supply voltage, the peak current began heading towards 200 A and beyond. This stretched the capabilities of the industry-reference SO-8 transistor package, driving power supply designs towards larger packages such as DPAK and even D2PAK to handle it all.
Learn more about our copper-clip tech from one of the pioneers responsible for changing the power packaging game, Ricardo “Ding” Yandoc – https://efficiencywins.nexperia.com/efficient-products/How-Copper-Clip-Makes-Perfect-Packages-for-the-Future-of-Power.html
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