It’s vital to know where and how heat travels when using MOSFETs in real-life applications. In this video, Andrei explains how heat travels from the die to the mounting base and why the drain tab thickness has the biggest impact on Rth(j-mb). He also discusses how the MOSFETs are mounted, directly on a heatsink or PCB, and how this can affect thermal performance.
For a fair comparison, Andrei shows two devices with a similar RDS(on), resulting in a similar die size in the 5×6 mm LFPAK56E package and the 8×8 mm LFPAK88 package.
Find out more on this topic in our MOSFET and GaN FET applications handbook: https://efficiencywins.nexperia.com/efficient-products/nexperia-design-engineers-guides.html
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