Photos from Nexperia’s post

Designers must carefully consider the heat dissipation requirements of an application and the impact different semiconductor package types will have on thermal behavior. To throw a little extra challenge into the mix is a growing demand for smaller footprints in our electronics.

Dr. Martin Roever is here to explain the heat dissipation pathways in our wire-bonded vs clip-bonded packages to ensure making the right choices on your next design.

Not everyone in the semiconductor industry goes into this amount of detail, but we believe the best way to enable innovation is through sharing all our expertise to simplify choices during the design process. Learn more about how our space-saving & thermally efficient components are empowering automotive electrification and the transition to power density packaging –

#savePCBspace #thermaleffeciency #designengineer #teamnexperia

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