The next step in SiC module compactness and maximum power density has arrived.
We’ve teamed up with Kyocera AVX Components (Salzburg) GmbH to jointly produce a new 650 V, 20 A Silicon Carbide (SiC) rectifier module for high-frequency power applications. A compact footprint helps maximize power density, reducing the amount of board real estate used and lowering overall costs. A combination of top-side cooling and an integrated negative temperature coefficient ensures optimal thermal performance for the next generation of power applications.
“This collaboration between Nexperia and KYOCERA AVX combines cutting edge silicon carbide semiconductors with state-of-the-art module packaging and represents the first step in what is envisaged as a long-term SiC partnership” – Katrin Feurle, Senior Director of the Product Group SiC.
Learn more about this exciting release – https://www.nexperia.com/about/news-events/press-releases/Nexperia-partners-with-KYOCERA-AVX-Salzburg-to-produce-a-650-V-silicon-carbide-rectifier-module-for-power-applications
#savepcbspace #SiC #teamnexperia #powerapplications
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