What is Project Samurai and how did it transform the semiconductor industry?
Two decades ago, Nexperia transformed the semiconductor industry with a unique clip-bond package for power MOSFETs. They called this disruptive innovation LFPAK, or loss-free packaging, offering the lowest power losses of any package type on the market. This new tech was revolutionary, offering radical performance improvements that gave early adopters more than they dared hope for in a MOSFET package.
In this video, we meet a few of the great minds behind this industry-shifting discovery in the Philippines and our MOSFET HQ in Manchester, UK.
We developed the LFPAK to meet the computing industry’s need for extremely high current when powering the latest processors. As each new silicon technology node brought exponentially more transistors on-chip, while also lowering the supply voltage, the peak current began heading towards 200 A and beyond. This stretched the capabilities of the industry-reference SO-8 transistor package, driving power supply designs towards larger packages such as DPAK and even D2PAK to handle it all.
We shipped more than 1.7 billion LFPAK devices in 2021, including MOSFETs and bipolar power transistors in LFPAK56 and its later derivatives from small size of 3 mm x 3 mm LFPAK33 to 8 mm x 8 mm LFPAK88. With the new CCPAK1212 now adding to the copper clip success story, we expect this technology to feature prominently in advanced power semiconductors for generations to come.
#semiconductor #engineering #innovation #teamnexperia
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