The word legend gets thrown around all too lightly, but in this case, it’s well deserved. It’s our absolute honor to nominate Ricardo “Ding” Yandoc for The Electronics Industry Awards 2023 in recognition of an inspiring career spanning almost 30 years.
Read more about his story and cast your vote – https://electronicsindustryawards.co.uk/2023-entry-details-page-individual-awards/?entryid=13762
Pioneer, innovator, inspirational leader and revered mentor, but he’d tell you with a massive smile to just call him Ding. He’s transformed the industry, being the creator behind the LFPA, and serving as a respected trainer, inspiring the next generation and new engineers.
His most important invention was the LFPAK in 2002. Featuring a unique clip-bond package for MOSFETs, LFPAK completely revolutionized the semiconductor industry two decades ago and continues to lead the field today. This significant development has advanced several industries, for example, enabling the electrification of vehicles.
#teamnexperia #engineering #20yearsLFPAK
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