Slight increases in line impedance can significantly improve the SI behavior of high-speed link.
High-speed interfaces are essential to satisfy the need for processing massive amounts of data. In all market segments, from consumer and computing to industrial and automotive, the trend is to introduce innovative technologies or to increase the data rate of existing interfaces to reach gigabit speeds. The computing segment usually leads the race for higher data rates. Just recently, the USB standard was extended to support 80Gbps with its latest revision USB 4.2. In automotive ethernet applications, the data rate will increase up to 25Gbps over a single differential pair.
Andreas and Martin show the SI of high-speed interfaces including an ESD protection device can be improved by modifying the layout of PCBs in our latest contribution to incompliance magazine. Click below for the full article.
This article describes a practical way to improve signal integrity of typical interfaces on the PCB when using external ESD devices.
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