PCIM Europe is just over a month away and we can’t wait to empower your next design with the Nexperia advantage.
Our Packaging Demo Zone draws on our rich history of innovation in semiconductor packaging delivering multiple industry-standard footprints from the SOT23 to LFPAK56. Our expertise in copper clip and miniaturization ensures designers have the right power package for the job.
Featured Demos:
• Power MOSFETs with low RDS(on) and continuous high current capability.
• Thermal Showdown (shown in video): Highlighting Nexperia’s power diode packaging technology for miniaturization and power density.
• Conduction, linear mode, and avalanche capability of MOSFETs in a power switch.
Send us a direct message or comment below to contact our booth team or stop by Hall 9 Booth 412 during #PCIM2024.
Check out our full lineup of live demos & talks – https://www.nexperia.com/about/news-events/events/pcim
#powerelectronics #semiconductor #mosfet
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