Learn how the unique properties of compact, leadless DFN packages compared to older leaded SMD packages translate into significant benefits for electronic designs.
Andre explains how the small size of DFN packages allows designers to fit more features onto a PCB and that this is especially important in automotive and mobile applications. Additionally, the DFN’s high thermal performance allows them to run cooler and improve system reliability and this is essential in high power density applications that run at high temperatures. DFN packages also provide an additional benefit in the form of reduced package inductance which is beneficial in switching applications because it enables faster switching frequencies.
Learn how to #savePCBspace with Nexperia – https://hubs.li/Q028kwhm0
(Feed generated with FetchRSS)