???? Building on over 20 years of expertise in supplying high-volume, high-quality copper-clip SMD packaging, we’re extending our revolutionary packaging approach to GaN cascode switches in CCPAK.
Our freshly launched GaN FET devices, featuring next-gen high-voltage GaN HEMT tech in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications. The GAN039-650NTB, a 33 mΩ (typ.) Gallium Nitride (GaN) FET within the CCPAK1212i top-side cooling package, ushers in a new era of wide bandgap semiconductors and copper-clip packaging. This technology offers advantages for renewable energy applications such as solar and residential heat pumps, reinforcing our commitment to developing the latest component technology for sustainable applications.
“Nexperia recognizes that designers of industrial and renewable energy equipment need a highly robust switching solution that can provide excellent thermal efficiency when performing power conversion” – Carlos Castro, Vice President and General Manager of the GaN FET business.
Learn more about the latest addition to our GaN FET portfolio –
https://www.nexperia.com/products/gan-fets/family/CCPAK-GAN-FETS-SMD/#/p=1,s=0,f=,c=,rpp=,fs=0,sc=,so=,es=
#GaN #widebandgap #renewableenergy #industrialapplications #CCPAK
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